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QianLi 3D BGA Reball Gold Stencil for iPhone 6S/6SP
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  • QianLi 3D BGA Reball Gold Stencil for iPhone 6S/6SP
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QianLi 3D BGA Reball Gold Stencil for iPhone 6S/6SP

Item NO.:3D  
Price:$10.00
Gross Weight:0.095kgs
Volume Weight:0.15kgs
Points:0.0
Views:400983
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QianLi 3D BGA Reball Gold Stencil for iPhone 6S/6SP











0.12mm thickness
3D BGA for A8 6 6P A9 6S 6SP A10 7 7P
It is 3D.
A8 contains all 6 6P BGA 
A9 contains all 6s 6sP
A10 contains all 7 7P

Feathure:

Stepped groove design enables stencil to align with tinning position of ic rapidly.
The square holes design makes it easier to take out the formed solder balls.
This 3D stencil is easy to use no matter you are a new or expert.
High success rate of planting tin,the solder balls can be formed once afer you are proficient.
This 3D planting stencil is thicker than ordinary stencils in the market.Less tendency of deformation makes its using life be longer.

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