QianLi Japan Laser Tech CPU BGA Reballing Gold Stencil for A12
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  • QianLi Japan Laser Tech CPU BGA Reballing Gold Stencil for A12
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QianLi Japan Laser Tech CPU BGA Reballing Gold Stencil for A12

Item NO.:Schablone  
Price:$9.99
Gross Weight:0.095kgs
Volume Weight:0.15kgs
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QianLi Japan Laser Tech CPU BGA Reballing Gold Stencil for A12











This is Japan High Precision BGA Reballing Stencil Template 0.12mm for iPhone A11 CPU ,can be heat directly.

Thickness: 0.12mm

Material: High Quality Stainless Steel

Hole Cut: Cubic-cut

Made in Japan

Large Quantity Lead Time Around one Week

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